GitLab

The HAL (or not HAL) is runtime detected, but as it has international help it can't go before 3.60.

Version 5.46. Tagged as 'BuildSys-5_46'

Detail:
  ModuleDB - Added SDCreate entry
  Components/ROOL/OMAP3, OMAP3Live, OMAP4 - Install SDCreate to <Install$Dir>.ABRelease, so it can be picked up by the ABRelease component
Admin:
  Tested with building & packaging OMAP3 ROM


Version 5.45. Tagged as 'BuildSys-5_45'

* Enable DualSerial
* Turn off debug in video driver
Requires OMAP4 HAL version 0.05.
Submissions from Willi Theiss.

Version 5.44. Tagged as 'BuildSys-5_44'

Do actively report when the CMHG file is deleted in CModule.
Add PRISMLIB to the available module libraries.
Components files updated to pass USB driver switches via CDEFINES not
CFLAGS.
Tested with OMAP3 ROM build, other components files modified by eye but
not tested.

Version 5.39. Tagged as 'BuildSys-5_39'

Version 5.38. Tagged as 'BuildSys-5_38'

Detail:
  Components/ROOL/Disc - Added a RISC OS 5 compatible version of CLib to the !System installation. This allows the disc image to safely be used on versions of RISC OS 5 older than current.
Admin:
  Disc image builds OK and CLib module works OK, but no testing of disc image itself was performed


Version 5.37. Tagged as 'BuildSys-5_37'

Retagged.

Now builds from clean without errors.
Retagged.

* Added components file to generate a !System
* Binaries/Browse/BuildEnv/Disc/IOMD32/OMAP4/Printers/Tungsten add heading blocks and line stuff up
* OMAP3 remove unused switch from FPEmulator
* SysMap add mapping from Sovereign to 'V'
* CTools extra qualifiers on some modules to get help right for modules in the 310 directory
* AAsmModule when CMDHELP=None is in force you can infer that no international help is desired, therefore pass this as a switch to the module to allow it to remove the tokens from its help table (based on how the 'standalone' switch is done)

Version 5.35. Tagged as 'BuildSys-5_35'

Add CLEAN_DEPEND support to AAsmModule makefile fragment. Disable VFP/NEON assembler for Tungsten ROM versions of BASIC.

Detail:
  Makefiles/AAsmModule - Added ${CLEAN_DEPEND} as a dependency to the 'clean' rule, to allow components to extend the default rule. This is the same functionality that the CApp fragment offers.
  Components/ROOL/Tungsten - Disable VFP/NEON support in the BASIC assembler, due to lack of ROM space.
Admin:
  Required changes for BASIC 1.49


Version 5.33. Tagged as 'BuildSys-5_33'

Detail:
  Components/ROOL/Disc - Added NetTime and the VIDC sound setup plugin.
Admin:
  Disc image builds OK
  Version 2.02 or above of the non-VIDC SndSetup plugin required otherwise the VIDC version will never be launched.
  NetTime could do with a configuration window in InetSetup


Version 5.32. Tagged as 'BuildSys-5_32'

Detail:
  Components/ROOL/Tungsten - Added RTSupport, SCSISwitch, SCSISoftUSB, SCSIFS, SCSIFiler and CDFSSoftSCSI to the Iyonix ROM image.
Admin:
  Tested in Iyonix ROM softload


Version 5.30. Tagged as 'BuildSys-5_30'

Detail:
  Components/ROOL/IOMD32, OMAP3, OMAP4, Tungsten - These ROMs now include the SharedSound module
Admin:
  OMAP3 & Tungsten ROMs tested


Version 5.29. Tagged as 'BuildSys-5_29'

Version 5.28. Tagged as 'BuildSys-5_28'

Detail:
  Components/ROOL/OMAP3 - Added the DualSerial module to the ROM image.
Admin:
  Tested on rev A2 BB-xM


Version 5.26. Tagged as 'BuildSys-5_26'

Detail:
  Components/ROOL/Disc - Added portable module & callx library to list of exports
Admin:
  Required for SCSISwitch 2.07


Version 5.25. Tagged as 'BuildSys-5_25'

Detail:
  ModuleDB - Added entry for CDFSSoftSCSI
  Components/ROOL/OMAP3, Components/ROOL/OMAP4 - Added CDFSSoftSCSI to the OMAP ROM builds
  Components/ROOL/OMAP3 - Disable OMAPVideo debug output since it's no longer needed to try and help track down the black screen on boot issue
Admin:
  Tested in OMAP3 ROM build


Version 5.24. Tagged as 'BuildSys-5_24'

Version 5.22. Tagged as 'BuildSys-5_22'

Admin:
  Submission from Willi Theiß

Version 5.20. Tagged as 'BuildSys-5_20'

Detail:
  Components/ROOL/IOMD32, Components/ROOL/OMAP3, Components/ROOL/S3C2440, Components/ROOL/S3C6410,Components/ROOL/Tungsten - Now all use romlinker as their joiner instead of BigSplit2. Required change so that the new kernel can find the ROM build date in the ROM footer.
  Components/ROOL/OMAP3 - Use noimagesize option to prevent the ROM image size being poked into the ROM/HAL at offset &60
Admin:
  OMAP & Tungsten ROMs built and tested.
  Before my romlinker changes, romlinker was producing identical images to BigSplit2, so there shouldn't be any critical bugs lurking in the code.


Version 5.19. Tagged as 'BuildSys-5_19'

Detail:
  Components/ROOL/IOMD32 - Enabled some extra modules now that they work: ADFS, ParallelDeviceDriver, SerialDeviceDriver, SoundDMA
Admin:
  Tested in ROM softload on RiscPC.
  ADFS floppy support is currently disabled due to not working yet, and Maestro seems to be able to cause SoundDMA/SoundScheduler to crash.


Version 5.18. Tagged as 'BuildSys-5_18'

Detail:
  Components/ROOL/S3C2440, Components/ROOL/S3C6410 - Corrected Messages location. Added VFPSupport as "EXP" to allow Wimp to build. Speculatively switched from SoundDMA to SoundDMA_Tungsten, as both Samsung chips use AC97 audio. Removed unneeded MUSBDriver entries, OMAPVideo, and obsolete DADebug options.
  ImageName/SysMap - Added new entry for ARM11ZF machine type
Admin:
  Tested with building S3C2440 & S3C6410 ROMs. No runtime tests performed.


Version 5.17. Tagged as 'BuildSys-5_17'

Admin:
  Based on a code submission by Tom Walker

Version 5.16. Tagged as 'BuildSys-5_16'

Detail:
  Components/ROOL/OMAP3 - Kernel is now at FC018000, i.e. 96K offset instead of 64K.
Admin:
  Needed for my next batch of checkins to work. Also temporarily breaks OMAP3 builds until I'm done checking in.


Version 5.15. Tagged as 'BuildSys-5_15'

Version 5.11. Tagged as 'BuildSys-5_11'

Required for building various transient utilities that are found in the
Library directory from source rather than them being binary imports.

Version 5.09. Tagged as 'BuildSys-5_09'

Also pruned a lot of dead components from the ModuleDB file. I have been
unable to locate sources for any of them in either the closed source or
published source repositories.

Version 5.08. Tagged as 'BuildSys-5_08'

Version 5.07. Tagged as 'BuildSys-5_07'

Version 5.05. Tagged as 'BuildSys-5_05'

Version 5.04. Tagged as 'BuildSys-5_04'

Detail:
  * Fixed dependencies for debug builds in GNUmakefiles/CApp
  * Added -f switch to rm in GNUmakefiles/StdTools to make it fail silently
    if the file doesn't exist, like the RISC OS version
  * Fix for amu complaining if INSTTYPE is undefined in Makefiles/CApp
  * Reflected makefile changes in resgen, squeeze and xpand in CTools
    component file
  * Added a8time to ModuleDB and CTools component file
Admin:
  Tested in  a C Tools build

Version 5.03. Tagged as 'BuildSys-5_03'

Version 5.02. Tagged as 'BuildSys-5_02'

Detail:
  Components/ROOL/OMAP3 - Updated components file to enable OMAPVideo debugging by default, to help try and track down video issues on IGEP boards
Admin:
  Tested in OMAP ROM on rev C2 beagleboard


Version 5.00. Tagged as 'BuildSys-5_00'

Detail:
  SCSIFiler is now no longer dependent on ADFSFiler's resources, so there's no point including ADFSFiler in the ROM image.
Admin:
  Tested on rev C2 beagleboard


Version 4.99. Tagged as 'BuildSys-4_99'

Version 4.98. Tagged as 'BuildSys-4_98'

Version 4.97. Tagged as 'BuildSys-4_97'

Version 4.96. Tagged as 'BuildSys-4_96'

Version 4.95. Tagged as 'BuildSys-4_95'

Removed CircleSetup screensaver config - it's meaningless.

Version 4.94. Tagged as 'BuildSys-4_94'

Version 4.93. Tagged as 'BuildSys-4_93'