GitLab

Detail:
  Components/ROOL/BCM2835, OMAP3, OMAP3Live, OMAP4, S3C2440, S3C6410 - Removed listings of USB driver debug options now that all that's needed is a simple "DEBUG=TRUE". Removed obsolete RHENIUM options. Disabled building/export of unnecessary drivers.
Admin:
  OMAP3 & BCM2835 ROMs tested.
  Others untested.


Version 5.63. Tagged as 'BuildSys-5_63'

Request from Willi Theiss, not tested here.

Version 5.62. Tagged as 'BuildSys-5_62'

Fix OMAP4, S3C build errors due to Kernel dependency on new header export. Bring OMAP3Live ROM modules in line with OMAP3.

Detail:
  Components/ROOL/OMAP4, S3C2440, S3C6410 - Add SerialDeviceSupport to export phase in order to get Hdr:SerialOp
  Components/ROOL/OMAP3Live - Add SerialDeviceSupport & SerialMouse to ROM
Admin:
  Untested!


Version 5.61. Tagged as 'BuildSys-5_61'

Moved SharedSnd up to the other sound modules, partly to group by function, but mostly so Freeway/ShareFS don't change position as they're commonly unplugged.

Version 5.57. Tagged as 'BuildSys-5_57'

Add FrontEnd to Disc image (in the 500 directory to avoid overwriting the 26 bit only copy in 310 as found in the PlingSystem distribution).

Version 5.53. Tagged as 'BuildSys-5_53'

Detail:
  Added UnSqzAIF to IOMD32, OMAP3, OMAP3Live, OMAP4, S3C2440, S3C6410 and Tungsten ROM images, to protect against the squeeze 5.03-5.08 bug. Even though the bug hasn't been seen on all platforms, there's no harm in taking precautions against it.
  Added UnSqzAIF to PlingSystem, for 3.70+
Admin:
  New version of UnSqzAIF tested in softload form on Iyonix
  OMAP3 ROM & PlingSystem build OK, others untested


Version 5.52. Tagged as 'BuildSys-5_52'

Detail:
  ModuleDB - Added SDCreate entry
  Components/ROOL/OMAP3, OMAP3Live, OMAP4 - Install SDCreate to <Install$Dir>.ABRelease, so it can be picked up by the ABRelease component
Admin:
  Tested with building & packaging OMAP3 ROM


Version 5.45. Tagged as 'BuildSys-5_45'

* Enable DualSerial
* Turn off debug in video driver
Requires OMAP4 HAL version 0.05.
Submissions from Willi Theiss.

Version 5.44. Tagged as 'BuildSys-5_44'

Do actively report when the CMHG file is deleted in CModule.
Add PRISMLIB to the available module libraries.
Components files updated to pass USB driver switches via CDEFINES not
CFLAGS.
Tested with OMAP3 ROM build, other components files modified by eye but
not tested.

Version 5.39. Tagged as 'BuildSys-5_39'

* Added components file to generate a !System
* Binaries/Browse/BuildEnv/Disc/IOMD32/OMAP4/Printers/Tungsten add heading blocks and line stuff up
* OMAP3 remove unused switch from FPEmulator
* SysMap add mapping from Sovereign to 'V'
* CTools extra qualifiers on some modules to get help right for modules in the 310 directory
* AAsmModule when CMDHELP=None is in force you can infer that no international help is desired, therefore pass this as a switch to the module to allow it to remove the tokens from its help table (based on how the 'standalone' switch is done)

Version 5.35. Tagged as 'BuildSys-5_35'

Detail:
  Components/ROOL/IOMD32, OMAP3, OMAP4, Tungsten - These ROMs now include the SharedSound module
Admin:
  OMAP3 & Tungsten ROMs tested


Version 5.29. Tagged as 'BuildSys-5_29'

Detail:
  ModuleDB - Added entry for CDFSSoftSCSI
  Components/ROOL/OMAP3, Components/ROOL/OMAP4 - Added CDFSSoftSCSI to the OMAP ROM builds
  Components/ROOL/OMAP3 - Disable OMAPVideo debug output since it's no longer needed to try and help track down the black screen on boot issue
Admin:
  Tested in OMAP3 ROM build


Version 5.24. Tagged as 'BuildSys-5_24'

Admin:
  Submission from Willi Theiß

Version 5.20. Tagged as 'BuildSys-5_20'

Detail:
  Components/ROOL/IOMD32, Components/ROOL/OMAP3, Components/ROOL/S3C2440, Components/ROOL/S3C6410,Components/ROOL/Tungsten - Now all use romlinker as their joiner instead of BigSplit2. Required change so that the new kernel can find the ROM build date in the ROM footer.
  Components/ROOL/OMAP3 - Use noimagesize option to prevent the ROM image size being poked into the ROM/HAL at offset &60
Admin:
  OMAP & Tungsten ROMs built and tested.
  Before my romlinker changes, romlinker was producing identical images to BigSplit2, so there shouldn't be any critical bugs lurking in the code.


Version 5.19. Tagged as 'BuildSys-5_19'

Detail:
  Components/ROOL/OMAP3 - Kernel is now at FC018000, i.e. 96K offset instead of 64K.
Admin:
  Needed for my next batch of checkins to work. Also temporarily breaks OMAP3 builds until I'm done checking in.


Version 5.15. Tagged as 'BuildSys-5_15'

Version 5.04. Tagged as 'BuildSys-5_04'

Version 5.02. Tagged as 'BuildSys-5_02'

Detail:
  Components/ROOL/OMAP3 - Updated components file to enable OMAPVideo debugging by default, to help try and track down video issues on IGEP boards
Admin:
  Tested in OMAP ROM on rev C2 beagleboard


Version 5.00. Tagged as 'BuildSys-5_00'

Detail:
  SCSIFiler is now no longer dependent on ADFSFiler's resources, so there's no point including ADFSFiler in the ROM image.
Admin:
  Tested on rev C2 beagleboard


Version 4.99. Tagged as 'BuildSys-4_99'

Version 4.98. Tagged as 'BuildSys-4_98'

Version 4.96. Tagged as 'BuildSys-4_96'

Version 4.95. Tagged as 'BuildSys-4_95'

Version 4.93. Tagged as 'BuildSys-4_93'

Detail:
  Binary blob of this module in CVS has been ARMv6-safe since May.
Admin:
  Untested as yet - about to try a ROM autobuild...

Version 4.92. Tagged as 'BuildSys-4_92'

Detail:
  RTSupport is now required to build SCSISoftUSB and (more importantly) included in the ROM image to enable the USB optimisations.
Admin:
  Tested on rev C2 beagleboard


Version 4.87. Tagged as 'BuildSys-4_87'

Detail:
  Thanks to the working !Boot sequence I've been able to finally test networking. As a result, the full set of networking modules are now enabled for OMAP3 ROM builds.
Admin:
  Tested on rev C2 beagleboard with ARMv7-safe copy of EtherUSB. InetSetup, Ping, and ShareFS seemed to behave themselves.


Version 4.84. Tagged as 'BuildSys-4_84'

Update CModule makefile fragment to use a default RESFSDIR if required. Add IIC module to OMAP3 components file.

Detail:
  Makefiles/CModule - makefile fragment now generates a default RESFSDIR value in an identical way to the AAsmModule fragment, easing migration of makefiles to the fragment system.
  Components/ROOL/OMAP3 - IIC module has been added to ROM image
Admin:
  Tested on rev C2 beagleboard


Version 4.80. Tagged as 'BuildSys-4_80'

Admin:
  Tested in a TungstenDev build on an Iyonix
Author:
  srevill

Version 4.79. Tagged as 'BuildSys-4_79'

Detail:
  ModuleDB - Added entry for new MUSBDriver module
  Components/ROOL/OMAP3 - Add MUSBDriver module to build. Add commented out lines for DADebug, debug versions of USB modules (saves me the hassle of remembering the right options all the time!)
Admin:
  Tested on Rev C2 beagleboard


Version 4.78. Tagged as 'BuildSys-4_78'

Detail:
  * Updates to CModule makefile fragment to reduce the number of OS-specific
    rules in main Makefiles:
    + Added (RAM|ROM)(C|ASM)DEFINES variables. These allow the calling makefile
      to specify additional defines for RAM or ROM builds of C or assembler
      source files respectively. Traditionally this was done by having separate
      object files for RAM and ROM corresponding at least to whichever source
      file was responsible for interfacing with ResourceFS, but this requires
      messy additional rules. With this new approach, it is necessary to clean
      the component when switching between RAM and ROM builds, but I don't
      think this will affect many people's workflows.
    + Added CMHGDEPENDS. This should be used to specify which object files need
      a static dependency upon the h file autogenerated from the cmhg file.
      It should be specified in the usual form for object files passed to
      CModule - with neither an o. prefix nor a .o suffix.
  * Added TBOXINTLIB to ModuleLibs makefile fragment.
  * AsmUtils, HdrSrc, TCPIPheaders, ToolboxLib and UnicodeLib all upgraded in
    ModuleDB from EXP to ASM or C components, to permit them to be built in the
    install phase. As a result, those other Components files that didn't
    already do so now need to override this back to -type EXP.
  * BuildHost Components file edited to reflect the fact that binaof, binasm,
    modgen and ResGen now have separate install phases for executables and
    Docs files.
Admin:
  The new Components file uses various components that are not publicly
  released, so it can only sensibly be used internally by ROOL. However, it's
  more convenient for us to keep it alongside the other Components files - and
  it also serves as an illustration of how to do a disc build.

Version 4.77. Tagged as 'BuildSys-4_77'

Detail:
  Components/ROOL/OMAP3 - Enabled building of ROM apps, SCSIFiler, etc. to allow a functional desktop environment to be used.
Admin:
  Tested on rev C2 beagleboard.


Version 4.72. Tagged as 'BuildSys-4_72'

Detail:
  Components/ROOL/OMAP3 - Many modules are now enabled for compilation. Rev C beagleboards should now have USB EHCI support, including support for USB keyboard, mouse and mass storage (via SCSIFS/DOSFS). Remember to disable DebugTerminal in Kernel.hdr.Options if you want USB keyboard input to work.
Admin:
  Tested on rev C2 beagleboard. Shouldn't adversely affect older beagleboards that lack working USB host ports.


Version 4.71. Tagged as 'BuildSys-4_71'

Detail:
  * Added new components file
  * Added entry for new HAL in the ModuleDB
  * Minor tweak to Makefiles:CModule so HALs can use shared Makefiles:
    no longer assumes that all callers wil have a non-null CMHGFILE
Admin:
  Used in a test build

Version 4.68. Tagged as 'BuildSys-4_68'